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Radley Software Platform at PACK EXPO 2016GRAND RAPIDS, Mich., Oct. 28, 2016 /PRNewswire/ -- Radley Corporation, a global software solutions provider announced they will be exhibiting at PACK EXPO International, the world's largest processing and packaging show, taking place November 6th through the 9th at Chicago's McCormick Place. This will be Radley's first time exhibiting and we are excited to share with the packaging industry how their flexible software helps manufacturers overcome challenges such as label compliance, traceability and environmental impact. Finding sustainable solutions economically to meet customer, industry and government standards while maintaining profitability is a major concern felt throughout the supply chain. By identifying areas that can be consolidated, automated and streamlined, Radley helps manufacturers significantly increase efficiency and visibility into various operations whether manufacturing food and husehold goods or the materials they are packaged in. With Radley You Can
Radley's robust solution platform of MES/WMS & EDI software provides flexible and configurable options for manufacturers who are either looking to enhance existing ERP and business systems or searching for a stand-alone solution to meet specific requirements such as Global Food Safety Certification (GFSI), GS1 labeling, DSCSA and more. Without sacrificing profitability, quality can be improved and operating costs decreased all while maintaining compliance. Don't wait until you're in the busy exhibit hall! Learn more now about Radley and download information about their platform of solutions. Discover why you should stop by booth E-10641 to chat with the Radley team when you're in Chicago! About Radley Corporation  Logo - http://photos.prnewswire.com/prnh/20160421/358496LOGO To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/radley-software-platform-at-pack-expo-2016-300352703.html SOURCE Radley Corporation 
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